Used OKAMOTO GNX 300 #9039632 for sale

Name: OKAMOTO GNX 300
Brand: OKAMOTO
SKU: 9039632
Availability: InStock

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Wafer Grinding, Lapping & Polishing

Manufacturer

OKAMOTO

Model

GNX 300

ID: 9039632

Vintage: 2001

Wafer back grinder, 8"-12" Grinding mode: Continuous down feed 2-Axes grinding spindle Rotation speed: 3,000 RPM Maximum Bearing: Air bearing Motor: 5.5 kW built-in motor Cooling method: Water cooled Maximum vertical stroke: 4" Vertical fast-grind speed: 8" per minute Grinding speed: 1 to 999 um per minute Grinder, 12" Grinding resistance reading: Monitoring current Output to CRT Horizontal angle adjustment: Manual Maximum radial load capacity: 30 kgf Maximum axial load capacity: 150 kgf Air consumption: (2) 20 L per minute Index table: (3) Vacuum chucks Vacuum chuck material: Porous ceramic Vacuum chuck rotation motor: (3) 1.0 kW AC Servo motors Vacuum chuck rotation speed: 400 RPM Maximum Chuck bearing: Air bearing Maximum radial load capacity: 30 kgf Maximum axial load capacity: 150 kgf Air consumption: (3) 36 L per minute Auto measuring device: Wafer thickness measurement method: Two-point in-process gauge Wafer thickness setting method: Final Wafer thickness displaying range: 1.8 mm Table cleaning unit: Cleaning method: Water and ceramic ring Wafer cleaning unit: Cleaning method: Water and brush operation panel Display method: 15" TFT Color touch panel Air supply: Consumption: 160 NL Per minute Pressure: 0.49 to 0.78 MPa Dew point: -15°C or lower Oil removal rate: 0.1 PPM W/W Grinding water: Water used: DI Water Pressure: 0.34 to 0.49 MPa Flow rate: 10 L per wafer Cooling water for vacuum pumps and spindles: Water used: City water Pressure: 0.19 to 0.49 MPa Flow rate: 10 NL Per minute Mist separator duct / General exhaust: Exhaust rate: 2 m³ per minute Vacuum pump duct / General exhaust: Exhaust rate: 75/90 m³/h, 50/60 Hz Power supply: Input power: 200V +/- 10%, 3-Phase, 50/60 Hz Power consumption: 20 kVA Grounding: Ground resistance JIS Type-3 100 Ohms or lower 2001 vintage.

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OKAMOTO GNX 300 is a state-of-the-art wafer grinding, lapping and polishing device. The machine is designed particularly for use in the semiconductor industry, as it offers high level of finish on both single and double-side double-layered wafers. This makes it ideal for the production of leading-edge integrated circuits. The machine features a powerful drive motor and planetary grinding discs that enable grinding of the semiconductor wafer to an extremely high degree of flatness and accuracy. The grinding discs have high concentricity, and can grind up to pieces with accuracy levels of 1¨ to 2µm. Additionally, the grinding discs can be adjusted in all directions for optimal pressing angles during the process. OKAMOTO GNX300 is equipped with two working heads, and each head can be individually adjusted for the pre-selected grinding angle of the wafer surface. This gives the operator superior control, and ensures uniform grinding quality. It can be used for wafers of different sizes. Furthermore, the machine is equipped with a spindle of variable speed range. This allows for both grinding and polishing operations to be carried out with higher precision. The spindle revs at up to 4,000rpm and ensures good process control when grinding and polishing. Moreover, the machine has built-in sensors that monitor load conditions during the process and protect the machine from any potential overload. This helps reduce downtime and helps keep the production running smoothly. The machine also incorporates an advanced wafer handling system. It has special handling fingers that gently gent and prevent damage caused during the grinding and polishing operation. It also has a low vacuum bar that maintains a low atmospheric pressure for better process control. The machine has a swing arm that helps easily move the wafers from the loading area to the process chamber, making the operation more efficient. Finally, the machine ships with advanced software which helps the operator closely monitor and control the grinding & polishing process. The software can be used to program the process, set slurry parameters, and monitor the process in real-time.Real-time monitoring of the process ensures consistent high-quality processes. In conclusion,GNX-300 is an advanced wafer grinding, lapping & polishing system that is capable to deliver accurate and consistent results for leading-edge integrated circuits. The machine combines powerful motor and planetary grinding discs to ensure grinding at high level of flatness and accuracy. It also features built-in sensors and an advanced wafer handling system for smoother operations.