Used OKAMOTO GNX 300 #9075387 for sale
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ID: 9075387
Vintage: 2004
Wafer back grinder, 12"
2-Axes grinding spindle
Rotation speed: Maximum 3000 RPM
2004 vintage.
OKAMOTO GNX 300 is an industry-leading wafer grinding, lapping, and polishing equipment designed for the highest precision dimensional accuracy and dielectric layer thickness control. Utilizing a hybrid of multi-directional grinding, rotational grinding, and traditional planar grinding, OKAMOTO GNX300 is an ideal solution for dynamic, large-scale applications requiring world-class process repeatability and excellent surface finishes. GNX-300 makes use of a multiprocessing approach, allowing for conventional grinding and lapping processes to be applied to the most challenging materials. This system is well-suited to demanding applications requiring fine micro-structures, capable of handling various materials, such as SiC, Si 3 N 4 , GaAs, diamond, and other ceramic materials. GNX300 wafer grinder is extremely reliable and easy to learn, allowing for significantly faster turnaround time than most conventional systems. This unit features a series of the latest, high-performance motors and drives, working in tandem with the latest in high-tech automation and robotics. The advanced control machine allows the user to intuitively program a variety of grinding, lapping, and polishing parameters, and provides precise control of the grinding, lapping, and polishing process. OKAMOTO GNX-300 incorporates a number of advanced safety features, including ESD protection, emergency stop, safety interlock, and temperature monitoring. To ensure long-term reliability, GNX 300 also utilizes advanced diagnostics and internal health monitoring, as well as a self-maintenance tool designed to perform preventive maintenance tasks on its own. The overall construction of OKAMOTO GNX 300 is designed for high production capability and reliable operations. The unit features an automatic wafer handling asset, a programmable spindle, and a rotary table to ensure accurate and repeatable operations at every cycle. OKAMOTO GNX300 is the perfect choice for those in need of an efficient and reliable wafer grinding, lapping, and polishing model. With its advanced control equipment, reliable construction and superior safety features, GNX-300 offers excellent process repeatability and precise surface finishes. Making use of the latest in motor and robotics technology, GNX300 is the perfect choice for those looking to produce the highest quality of results.
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