Used OKAMOTO GNX 300 #9135642 for sale

OKAMOTO GNX 300 is a wafer grinding, lapping, and polishing equipment that is designed to offer superior surface quality and accuracy at a fraction of the cost of traditional grinding systems. The machine features a 300 mm spindle that offers a low-profile grinding system with superior accuracy and material removal capabilities. Utilizing a range of specialized abrasive wheels and polishing media, the unit is capable of grinding to precision tolerances of +/-10 μm. The advanced controls of OKAMOTO GNX300 machine ensure repeatable results, with its servo motion control allowing for easy, automated adjustment of the feed rate and grinding pressure. The intuitive touchscreen display allows for quick parameter selection and enables the user to quickly dial in the optimal process settings for a given application. The tool also features a robust variable-speed motor that enables a wide range of abrasive media to be used, allowing for a variety of grinding and polishing applications. Additionally, it incorporates an overhead pneumatic asset, allowing for precise pressure control during grinding. The model's advanced grinding and polishing head also ensures that the wafers are held securely during processing. GNX-300 equipment also features an integrated chiller system to reduce thermal stresses and prevent thermal distortions due to grinding pressure, providing reliable results. Additionally, the unit utilizes an oil and water separator to guarantee that the lapping fluid reaches the grinding surface without oil contamination. For scribed wafers, the machine supports various wafer/part-clamping systems, allowing for precise alignment and contouring. The tool also supports automated wafer transfer to a host of secondary processing systems. Overall, GNX 300 offers a reliable, low-cost asset that provides outstanding results. With its advanced design, intuitive user interface, reliable accuracy, and wide range of polishing capacities, it is an ideal solution for a wide variety of wafer grinding, lapping, and polishing applications.