Used OKAMOTO GNX 300 #9135843 for sale

OKAMOTO GNX 300 is a wafer grinding, lapping and polishing equipment designed to optimize the production of semiconductor chips and other advanced materials. The system provides a reliable, repeatable performance for various applications, including wafer thinning, wafer polishing and wafer lapping. OKAMOTO GNX300 offers high precision robotic control through its CNC robotic arm unit and utilizes advanced software to precisely optimize the entire grinding and lapping process. The machine allows for high material removal rates of up to 59 cubic feet per hour, making it an ideal choice for processing large amounts of materials quickly and accurately. It features the innovative DSPC servo control for high speed, consistent and repeatable operation. GNX-300 also features a diamond polishing tool which can be customized to specific requirements for processing semiconductor wafers of any shape or size in order to achieve the highest precision results. The asset also includes an advanced vacuum model for optimal wafer cleanliness and an enclosed grinding and lapping chamber for efficient cleaning and maintenance. In addition, this equipment features a range of sensors for automatic detection and control of the grinding process. The system offers a wide range of grinding modes, such as a high speed mode to maximize material removal rate and high precision mode to minimize defects or surface roughness. The unit can also be equipped with a "High Saturation Grinding" machine to further reduce surface roughness. Overall, OKAMOTO GNX-300 is a feature-rich, high-performance wafer grinding, lapping and polishing tool perfectly designed for efficient and repeatable production of semiconductor chips and other advanced materials. It offers robust, advanced software and automation technology as well as many sensor-driven self-monitoring options, which guarantee unmatched repeatability and precision of production process.