Used OKAMOTO GNX 300 #9136113 for sale

OKAMOTO GNX 300 is a wafer grinding, lapping and polishing equipment designed for semiconductor manufacturing processes. The system features robust construction, precision machinery and an advanced control unit to produce smooth, planarized wafer surfaces with high uniformity. OKAMOTO GNX300 includes a high-precision spindle motor with closed-loop control for accurate wafer positioning. This motor allows greater control over the surface grinding process, producing capabilities up to 300mm wafers with high degree of surface smoothness and uniformity. The spindle motor is able to generate torque up to 12Nm with speeds up to 6000 RPM. Furthermore, the machine can also maintain a high degree of accuracy in multiple passes due to the precise closed-loop control, reducing surface irregularities and producing better results. In addition, GNX-300 includes both single- and double-sides lapping systems. This allows for the lapping of wafer edges and surfaces, providing superior surface planarization and uniformity. The tool is able to achieve very fine lapping effects, with surface finishes up to 0.3µm RA. The mechanism also allows for high-speed processing to reduce setup and cycle times while providing consistent wafer results. GNX 300 also includes a polishing asset, which includes dual-belt polishing. This offers the capability to polish both sides of the wafer at the same time with uniform results. The polishing model can achieve micro-fine finishes on the wafer surface, down to 1nm surface roughness. Finally, OKAMOTO GNX-300 has an advanced control equipment with multiple process recipes and process monitoring capabilities. This offers flexible and reliable process control for grinding, lapping and polishing with precision accuracy. The system also has an intuitive user interface, which allows operators to improve the unit's process efficiency and ensure consistent results for a variety of wafer types and sizes. In summary, GNX300 provides a comprehensive wafer grinding, lapping, and polishing machine that offers high precision capabilities, advanced control features, and robust construction for improved process reliability and performance. The tool is ideal for use in semiconductor production processes and makes the complex processes of wafer processing hassle-free. Moreover, OKAMOTO GNX 300 is able to produce high quality results with greater accuracy and higher outputs.