Used OKAMOTO GNX 300 #9137636 for sale

OKAMOTO GNX 300 is an advanced wafer grinding, lapping and polishing equipment designed to provide high accuracy and repeatability. It is ideal for a wide range of applications such as high density integrated circuit (HDI) fabrication, optoelectronics and MEMS production. OKAMOTO GNX300 uses a grinding, lapping and polishing process that is capable of improving flatness, surface roughness and other optical parameters of the wafer. The powerful grinding capabilities of this machine can be used to remove scratches, chips, and other defects from wafer surfaces. The lapping process allows the machine to achieve the required flatness and surface finish. Meanwhile, a polishing process can be used to create a highly reflective and uniform surface, ensuring there are no surface defects or roughness. GNX-300 is designed with a variety of features to ensure that the process is efficient and accurate. An integrated loading/unloading system allows for quick and easy wafer access and changing. A precision axis driving unit also ensures accurate movement and positioning of the components during the process. The advanced control machine offers intuitive operation for increased user-friendliness. GNX 300 has a range of other features such as an automatic nozzle cleaning and wafer mounting tool, an automatic flatness measuring asset, and a ring light with remote control. It is also equipped with servo motors and precision encoders that can assist in accurately controlling the machine's movement and providing stability. GNX300 is an efficient and reliable wafer grinding, lapping and polishing model that is ideal for producing high quality results for a range of applications. Its extensive range of features and accuracy capabilities ensure quick and consistent results with optimal productivity.