Used OKAMOTO GNX 300 #9146480 for sale

Name: OKAMOTO GNX 300
Brand: OKAMOTO
SKU: 9146480
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Wafer Grinding, Lapping & Polishing

Manufacturer

OKAMOTO

Model

GNX 300

ID: 9146480

Back grinder, 8"-12" Grinding mode : Continuous down feed Grinding spindle : 2 axes Rotation speed : 3,000 rpm maximum Air bearing Motor : 5.5 kW built-in motor Cooling method : Water-cooled Maximum vertical stroke : 4" Vertical fast-grind speed : 8" per minute Grinding speed : 1 to 999 um per minute Grinder diameter : 12" Grinding resistance reading : Monitoring current, output to CRT Horizontal angle adjustment : Manual Maximum radial load capacity : 30 kgf Maximum axial load capacity : 150 kgf Air consumption : 20 L per minute x 2 Index table : (3) Vacuum chucks Vacuum chuck materia l: Porous ceramic Vacuum chuck rotation motor : 1.0 kW AC servo motor x 3 Vacuum chuck rotation speed : 400 rpm maximum Chuck bearing : Air bearing Maximum radial load capacity : 30 kgf Maximum axial load capacity : 150 kgf Air consumption : 36 L per minute x 3 Auto measuring device : Wafer thickness measurement method : Two-point in-process gauge Wafer thickness setting method : Final Wafer thickness displaying range : 1.8 mm Display method : 15" TFT Color touch panel Power supply : Input power : 200V +/- 10%, 3 phase, 50 / 60 Hz Power consumption : 20 kVA Grounding : Ground resistance JIS type 3 100 ohms or lower Air supply : Consumption : 160 NL per minute Pressure : 0.49 to 0.78 MPa Dew point : -15°C or lower Oil removal rate : 0.1 PPM W / W Grinding water : Water used : DI water Pressure : 0.34 to 0.49 MPa Flow rate : 10 L per wafer Cooling water for vacuum pumps and spindles: Pressure : 0.19 to 0.49 MPa Flow rate : 10 NL per minute Mist separator duct / general exhaust: Connection : Duct hose, 4" outer diameter Vacuum pump duct / general exhaust : Connection : Duct hose, 4" outer diameter 2001 vintage.

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OKAMOTO GNX 300 is a state-of-the-art wafer grinding, lapping and polishing equipment engineered for precision and accuracy, making it the perfect choice for high-precision wafer applications. This system is designed to deliver the highest levels of throughput and productivity while maintaining the utmost quality standards. The unit is constructed of robust stainless steel for improved longevity and features robust construction for long-term reliability. An automated touch-screen control panel allows for simple operation and monitoring of all activities. OKAMOTO GNX300 is capable of grinding, lapping, and polishing of a wide range of wafer sizes. The grinding head is able to accommodate two different rotation speeds, allowing for customized grinding and polishing. The optional top-lapping strategy ensures uniformity of the wafer surface side, enabling high precision and accuracy. GNX-300 is powered by a high-performance, 4-axis servo motor and a closed-loop control machine. This tool features an adjustable grinding wheel, as well as a polishing cloth holder that can be adjusted for optimal polishing. The adjustable grinding wheel ensures high repeatability, allowing for quickly achieving the desired tolerance. GNX 300 is also equipped with advanced safety features to ensure the safety of the operator and personnel. These features include an emergency-stop button and interlock switch, preventing accidental operation or shock from mishandling. Additionally, GNX300 features a reduce-heat feature, mitigating the risk of overheating caused by prolonged grinding or polishing operations. Finally, OKAMOTO GNX-300 is designed for fast installation and upscaling. The asset comes pre-configured so that it can be quickly connected to the customer's existing setup. Furthermore, the model provides major convenience with its optional data management equipment, data recording and analysis, and full documentation.