Used OKAMOTO GNX 300 #9187427 for sale

OKAMOTO GNX 300 wafer grinding, lapping & polishing equipment is designed to provide industry-leading accuracy and uniformity for a range of production processes. It enables the efficient processing of wafers up to 200 mm in diameter with the highest levels of surface quality and repeatability. The system consists of an enclosed, two-chamber unit constructed in stainless steel that allows for both linear and horizontal grinding. In addition, the GNX controls the process with motorized tables to ensure an accurate and uniform production. OKAMOTO GNX300 is perfect for the grinding of a variety of superpolished samples including silicon, garnet, and other ceramics. It features an automatic grinding wheel retraction, vibration-free grinding, and a user-friendly operation machine. The GNX also enables an automated process, producing up to 30 wafers per hour. This high degree of automation helps reduce the risk of operator error. The GNX makes use of a three-step abrasive process: a slow material removal grinding step, a fast cleaning/polishing step, and a high-precision ultra-polishing step. This allows for a high degree of accuracy and repeatability in the production of wafers. Additionally, the GNX features a top-end ceramic-bond diamond wheel for superior results. The unique diamond wheel allows for excellent grinding, lapping, and polishing of a variety of materials. GNX-300 wafer grinding, lapping & polishing tool enables the industry-leading accuracy and uniformity for a range of production processes. Its enclosed design ensures superior grinding and polishing results while an automated process helps reduce errors and increase efficiency. The combination of precision ceramic-bond diamond wheels and a three-step abrasive process enables the highest degrees of accuracy and repeatability when producing wafers. All in all, the GNX is the perfect wafer-polishing asset for any production line.