Used OKAMOTO GNX 300 #9192487 for sale

OKAMOTO GNX 300 is a state-of-the-art equipment for wafer grinding, lapping and polishing. This innovative system offers solutions for precision surface finishing and processing requirements. It is designed to precise process parameters and ensure accurate repeatability for the most efficient grinding and polishing operations. The main components of the unit include a grinding spindle, replaceable grinding segments and an integrated touching off device. The grinding spindle is capable of producing a ground surface finish up to 0.3μm in roughness on materials such as quartz, sapphire, and polycrystalline materials. The replaceable grinding segments provide the uniformity required for efficient material removal. The integrated touching off device quickly and accurately adjusts for different materials and shapes, eliminating the need for multiple settings. OKAMOTO GNX300 machine offers the highest level of performance features such as adjustable parameters for grinding and polishing, precise pressure control and high accuracy grinding. The advanced control tool provides a user friendly interface and display of machine parameters. The integrated grinding software ensures precise repeatability of grinding and polishing operations for accuracy and efficiency. The asset offers a fully automatic grinding mode as well as flexible manual control. The automatic mode can be operated with specific parameters for different materials and processes. The manual mode allows for manually adjusted parameters and optimized cutting technique. This model is designed to handle the most difficult and delicate jobs with high precision and reliability. GNX-300 equipment is offered with a wide variety of options including aux. grinding head, carrier wafer feed system, table auto loader for shorter cycle time and vacuum unit for precision grinding. This machine is reliable and easy to use, offering maximum performance with minimum effort. The compact design of the machine takes up less floor space in the workshop. GNX300 tool is an excellent choice for high-quality wafer grinding, lapping and polishing operations. It is built with precise repeatability and advanced features, providing an excellent solution for large-scale production applications. This asset is designed for repeatable, accurate, and highly efficient performance for every kind of wafer production needs.