Used OKAMOTO GNX 300 #9222310 for sale

OKAMOTO GNX 300 is a wafer grinding, lapping, and polishing equipment suitable for many types of wafer-based products including semiconductors and photonics. This machine offers a high level of accuracy and reliability, with a controllable material removal rate. It is also equipped with a self-robot system on the loading/unloading station, enabling unattended operation. OKAMOTO GNX300 utilizes a unique charging technique which employs a three-dimensional spiral grinding wheel parameter. This allows for superior removal rates and extremely fine surfaces with a low-stress finish. The unit can be automated with robotics, allowing for straight-from-the-machine processing eliminating manual handling steps. GNX-300 is capable of two-axis and three-axis grinding processes. The two-axis grinding capabilities allow for the grinding of surfaces and flat disks while the three-axis grinding capability allows for grinding of intricate shapes. OKAMOTO GNX-300 utilizes both computer numerical control (CNC) and manual control to govern each grinding and polishing cycle. The machine also utilizes a high-resolution 3-step stage that uses the latest closed-loop positioning technology to ensure accurate placement of wafers, and result in optimal results. The noise level during operation is kept to a minimum, and a safety switch is put in place to turn off the machine in case of an emergency. GNX300 is also equipped with an alarm machine and a dust collector that helps keep the working area clean and dust-free. GNX 300 has superior performance in repeatability, accuracy and reliability. The unit can be used for grinding and polishing applications as well as a wide variety of other processes. The sturdy construction of this machine ensures a low maintenance cost with a relatively long lifespan. OKAMOTO GNX 300 is a cost effective and efficient way for any manufacturing operation to achieve desired end products.