Used OKAMOTO GNX 300 #9258777 for sale

OKAMOTO GNX 300
ID: 9258777
Back grinder.
OKAMOTO GNX 300 Wafer Grinding, Lapping & Polishing equipment is a fully automated industrial machine designed to process wafers with precision and speed. The system works by combining three core technologies: lapping, grinding, and polishing. The unit starts by lapping the surface of the wafer with diamond abrasives. This process is used to produce a repeatable, uniform flatness across the surface that has high accuracy and repeatability. Then grinding is used to remove material while maintaining the flatness produced by lapping. During this process, a thinner surface layer is created with high uniformity and precision. Finally, polishing is used to create a high-precision, flat mirror surface on the wafers. The machine features several high-end components, such as a multi-axis, automated stage that allows for precise part positioning and a programmable, one-chip PLC-based control. It also utilizes a number of advanced technologies, including advanced algorithms, touch-screen control, preset programs, and a fully automated operation. The tool also employs a closed-loop vacuum asset to ensure that the wafers are held securely in place during the entire process. The model is able to process both single- and double-sided wafers and produces excellent results. The equipment is designed for repeatability and accuracy even with different-sized wafers, and is able to process wafers up to 8 inches in diameter. It also boasts a throughput rate of up to 30 wafers per hour, making it ideal for mass production. Finally, OKAMOTO GNX300 system is designed with safety in mind. The machine has safety interlocks and sensors to ensure that the operator is always safe. The unit also powers down automatically when necessary to prevent any unwanted damage to the wafers. Additionally, the machine can be easily moved and is very easy to use. Overall, GNX-300 Wafer Grinding, Lapping & Polishing tool is an excellent industrial machine and is great for mass-producing high-precision wafers in a safe and efficient manner.
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