Used OKAMOTO GNX 300B #9283751 for sale

OKAMOTO GNX 300B is a state-of-the-art wafer grinding, lapping & polishing equipment used by the semiconductor manufacturing industry in the production of ultra-high-precision silicon-based products. It is a fully automated and ultra-compact machine, suitable for medium-to-large production runs. The overall dimensions of GNX 300B are 1300mm in width, 1560mm in length and 1590mm in height. OKAMOTO GNX 300B is designed with its own patented dust and magnetic particle separator, ensuring environmentally friendly operations. It can accommodate various sizes of wafer substrates up to a maximum diameter of 300mm. GNX 300B utilizes high-efficient grinding and lapping systems with a loop type linear motor drive system that delivers smooth and precise, high-frequency grinding. It is also equipped with an angular polishing head for high surface quality. The machine provides an advanced in-situ spindle force measurement for regular monitoring and maintenance purposes. OKAMOTO GNX 300B also features an intuitive human-machine interface that allows complete process control such as process monitoring in real-time, recipe management, and maintenance record storage. GNX 300B can be integrated into a Manufacturer Execution Systems (MES), allowing for full tracking and traceability of the production process. The unit is equipped with a reliable safety machine with sensors for collision detection and protection of the machine and the operators. To further reduce the risk of disrupting the production process, OKAMOTO GNX 300B includes a built-in alarm tool. Overall, GNX 300B offers an advanced, automated and cost-effective solution for high-precision grinding, lapping and polishing of silicon wafers. With its robust design, reliable performance and intuitive user interface, this machine is ideal for medium-to-large-scale production and is capable of meeting the high-precision grinding requirements of the semiconductor manufacturing industry.