Used OKAMOTO GNX 300P #9135924 for sale

Name: OKAMOTO GNX 300P
Brand: OKAMOTO
SKU: 9135924
Availability: InStock

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Wafer Grinding, Lapping & Polishing

Manufacturer

OKAMOTO

Model

GNX 300P

ID: 9135924

Wafer Size: 8"-12"

Back grinder, 8"-12" Grinding mode: Continuous down feed Grinding spindle: (2) Axes Rotation speed: 3,000 RPM Maximum Bearing: Air bearing Motor: 5.5 kW Built-in motor Cooling method: Water cooled 4" Maximum vertical stroke Vertical fast-grind speed: 8" Per minute Grinding speed: 1 to 999 µm Per minute 12" Grinder diameter Grinding resistance reading: Monitoring current, output to CRT Horizontal angle adjustment: Manual Maximum radial load capacity: 30 kgf Maximum axial load capacity: 150 kgf Air consumption: (2) 20 L Per minute Index table: (3) Vacuum chucks Vacuum chuck material: Porous ceramic Vacuum chuck rotation motor: (3) 1.0 kW AC Servo motor Vacuum chuck rotation speed: 400 RPM Maximum Chuck bearing: Air bearing Maximum radial load capacity: 30 kgf Maximum axial load capacity: 150 kgf Air consumption: (3) 36 L Per minute Auto measuring device: Wafer thickness measurement method: Two-point in-process gauge Wafer thickness setting method: Final Wafer thickness displaying range: 1.8 mm Table cleaning unit: Cleaning method: Water and ceramic ring Wafer cleaning unit: Cleaning method: Water and brush Operation panel: Display method: 15" TFT Color touch panel Air supply: Consumption: 160 NL Per minute Pressure: 0.49 to 0.78 MPa Dew point: -15°C or Lower Oil removal rate: 0.1 PPM W / W Grinding water: Water used: DI Water Pressure: 0.34 to 0.49 MPa Flow rate: 10 L Per wafer Cooling water for vacuum pumps and spindles: Water used: City water Pressure: 0.19 to 0.49 MPa Flow rate: 10 NL Per minute Mist separator duct / General exhaust: Exhaust rate: 2 m³ Per minute Connection: Duct hose 4" Outer diameter Vacuum pump duct / General exhaust: Exhaust rate: 75/90 mA3 / h, 50 / 60 Hz Connection: Duct hose 4" Outer diameter Power consumption: 20 kVA Grounding: Ground resistance JIS type 3 100 ohms or lower Power supply: Input power: 200 V +/- 10% 3 Phase 50 / 60 Hz.

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OKAMOTO GNX 300P is a high performance wafer grinding, lapping and polishing equipment. It is designed with precision technology to help achieve demanding process requirements. It boasts a wide variety of customizable settings that enable users to fine-tune the machine's operations to best suit their specific production requirements. OKAMOTO GNX300P has a touch-free structure which allows its motor-driven point contact wheel and special-form working surface to move in both the X and Y axes. This allows for efficient use of the available space and allows easy operation during loading and unloading of the machine. The high-speed brushless grinding spindle further increases the accuracy and speed of the machine's work. The device consists of two main modules, the work unit and the loading automation unit. The work unit consists of a main spindle motor, a touch-free grinder spindle, a chip turning disc, an air driven chuck, and a coolant pump. The loading automation unit features a wafer aligned loader, cassette lift, and a cassette shuttle. It also has support components such as a spindle monitor and a vibration monitor. GNX 300P features a completely enclosed design, making it safe for use in a cleanroom environment. It is equipped with an exhaust system which ensures that harmful particles and gases produced during operation are removed from the work environment. The entire unit is mounted on a vibration isolator table, for minimized vibration and higher accuracy of production. GNX300P is made of top-quality components and advanced features, ensuring optimal process performance in a wide variety of production applications. It has a powerful range of grinding and polishing modes which can be set with the programmable digital control machine. Additionally, it also offers a patented zero-site adjustment technique, which further increases precision levels and accuracy. This wafer grinding, lapping and polishing tool is an excellent choice for production applications, particularly for materials that require a fine finish and precise results.