Used OKAMOTO GNX 300P #9186570 for sale
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ID: 9186570
Wafer Size: 8"-12"
Vintage: 2001
Back grinder, 8"-12"
Polisher: No
Grinding mode: Continuous down feed
Grinding spindle: (2) Axes
Rotation speed: 3,000 RPM Maximum
Bearing: Air bearing
Motor: 5.5 kW Built-in motor
Cooling method: Water cooled
Maximum vertical stroke, 4"
Vertical fast-grind speed: 8" Per minute
Grinding speed: 1 to 999 µm Per minute
Grinder diameter, 12"
Grinding resistance reading: Monitoring current, output to CRT
Horizontal angle adjustment: Manual
Maximum radial load capacity: 30 kgf
Maximum axial load capacity: 150 kgf
Air consumption: (2) 20 L Per minute
Index table:
(3) Vacuum chucks
Vacuum chuck material: Porous ceramic
Vacuum chuck rotation motor: (3) 1.0 kW AC Servo motor
Vacuum chuck rotation speed: 400 RPM Maximum
Chuck bearing: Air bearing
Maximum radial load capacity: 30 kgf
Maximum axial load capacity: 150 kgf
Air consumption: (3) 36 L Per minute
Auto measuring device:
Wafer thickness measurement method: Two-point in-process gauge
Wafer thickness setting method: Final
Wafer thickness displaying range: 1.8 mm
Table cleaning unit:
Cleaning method: Water and ceramic ring
Wafer cleaning unit:
Cleaning method: Water and brush
Operation panel:
Display method: 15" TFT Color touch panel
Air supply:
Consumption: 160 NL Per minute
Pressure: 0.49 to 0.78 MPa
Dew point: -15°C or Lower
Oil removal rate: 0.1 PPM W / W
Grinding water:
Water used: DI Water
Pressure: 0.34 to 0.49 MPa
Flow rate: 10 L Per wafer
Cooling water for vacuum pumps and spindles:
Water used: City water
Pressure: 0.19 to 0.49 MPa
Flow rate: 10 NL Per minute
Mist separator duct / General exhaust:
Exhaust rate: 2 m³ Per minute
Connection: Duct hose
Outer diameter, 4"
Vacuum pump duct / General exhaust:
Exhaust rate: 75/90 mA3 / h, 50 / 60 Hz
Connection: Duct hose
Outer diameter, 4"
Power consumption: 20 kVA
Grounding: Ground resistance JIS type 3 100 ohms or lower
Power supply:
Input power: 200 V +/- 10%
3 Phase
50 / 60 Hz
Currently warehoused
2001 vintage.
OKAMOTO GNX 300P is a wafer grinding, lapping and polishing system that is designed for precision refinement of flat wafers. It is designed for a variety of polishing operations involving various materials such as sapphire, glass, silicon and ceramic. OKAMOTO GNX300P is capable of handling up to 4" wafers and has a main spindle capable of speeds up to 2000 RPM. It is also designed to be low-maintenance, with components such as the stainless steel shroud being corrosion-resistant to ensure it can withstand the grinding and polishing environment. The device features safety guards to protect the operator from dust contamination, as well as a dust collection system to collect water and slurry, ensuring clean air. GNX 300P works with a diverse selection of grinding and lapping consumables for superior quality results. It is capable of using various types of lapping films, diamond slurries and suspensions of diamond or alumina to get highly refined surfaces. The grinding/lapping heads can be programmed with various speeds and abrasive combinations, and the lapping table is adjustable for various post-polish operations. When using GNX300P, care must be taken to ensure that the wafer's surface is completely covered by the grinding/lapping head in order to ensure total surface coverage and uniform polish. Additionally, operators should take safety precautions, such as wearing protective gear and using all necessary guards and shields to protect themselves and the device, ensure successful grinding and lapping results. In short, OKAMOTO GNX 300P is a cutting-edge wafer grinding, lapping and polishing system, designed to provide consistent and reliable results in a safe manner. Its reliable performance, wide variety of consumable options and adjustable lapping table make it an ideal choice for precision refinement of flat wafers.
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