Used OKAMOTO GNX 300P #9192488 for sale

OKAMOTO GNX 300P is a precision configured wafer grinding, lapping, and polishing equipment designed for state-of-the-art wafer manufacturing. The system provides superior grinding and polishing results, as well as fully automated grinding, lapping, and polishing operations. OKAMOTO GNX300P is designed to accommodate almost any size and shape of wafer, up to 300mm, with a high volume capacity of up to 500 pieces at a time. Using multi-process technology, GNX 300P can precisely grind, lapping, and polish wafers simultaneously. This allows for a highly efficient production process that effectively minimizes the time needed for production and increases yield. GNX300P also utilizes variable speed drive technology to control the grinding, lapping, and polishing operations in order to achieve the desired quality results. OKAMOTO GNX 300P also offers an ultrasonic cleaning unit to protect tools and wafers during production. The ultrasonic cleaning process reduces the risk of particle contamination as well as preventing any debris from adhering to the wafers. The machine includes gas pre-pressurization, which prevents the gases from settling and forming bubbles during the grinding, lapping, and polishing processes. OKAMOTO GNX300P is equipped with a spindle drive tool to control the grinding, lapping, and polishing. This asset offers a maximum speed of up to 17000 RPM and allows for the precise control of the process to ensure accuracy and consistency, even over long production runs. GNX 300P includes a wafer conveyor for efficient loading and unloading. The conveyor is designed to accommodate a wide range of wafer sizes, shapes, and thicknesses. The conveyor can also be utilized to precisely orient and position the wafers during the grinding, lapping, and polishing process. GNX300P also offers advanced automated alignments that guarantee consistent results. This ensures that wafers will maintain their original shape and dimension before, during, and after the grinding, lapping, and polishing process. OKAMOTO GNX 300P Wafer Grinding, Lapping & Polishing model is the perfect production tool for the precision grinding, lapping, and polishing of high quality wafers. Its high level of automation, precision grinding, and polishing results, along with its advanced features make it the ideal equipment for any wafer manufacturing organization.