Used OKAMOTO GNX 300P #9280193 for sale

OKAMOTO GNX 300P is a wafer grinding, lapping & polishing equipment designed for grinding, lapping & polishing from 1/2" to 6" round wafers for any number of applications. It features an adjustable grinding depth and adjustable grinding angle to provide precise surfaces with smoothness and uniformity. This system is perfect for users who demand high production rates with excellent, quality control and performance. OKAMOTO GNX300P is designed with a wafer-orientated double rack-pinion table that supports a direct-drive load and speed regulating motor. The motor drive the double rack pinion table in the direction of the grinding wheel for grinding high-quality wafers with complex geometries. GNX 300P is capable of processing multiple wafers simultaneously and is equipped with a high automation mode to save time and energy for unattended operation. The unit also controls the total amount of lapping material used along with the speed and pressure. It is integrated with an advanced digital image processing machine to process large numbers of wafer surfaces and an integrated air-cleaning tool keeps the machine and production environment clean. GNX300P is designed with a highly efficient diamond-in-nickel abrasive wheel for grinding, lapping and polishing different widths and thicknesses of the wafer and includes an angle-dresser that easily dresses the run-in abrasive wheel. It also has a MicroLeveler grinding wheel truing asset that continuously monitors the grinding wheel true profile by taking its measurements from each reference point using a rugged optical encoder. To ensure ultimate convenience, OKAMOTO GNX 300P comes with an automated product loading and unloading model that allows for fast and convenient wafer exchange. The equipment also offers user-friendly operation with an intuitive touch panel determining the settings and operation needs of the user. For the best possible performance, an additional add-on feature is available that enables the cleaning of process residue and contamination removal using a cleaning tool. OKAMOTO GNX300P is an advanced wafer grinding, lapping & polishing system designed to deliver superior quality results and an easy-to-use interface. It offers a comprehensive range of features to make sure that the users are completely satisfied with their results and production rates.