Used OKAMOTO GNX12PB #293608780 for sale

OKAMOTO GNX12PB is a wafer grinding, lapping and polishing equipment designed for high-precision wafer processing. It is a state-of-the-art, automated solution for grinding, lapping and polishing wafers ranging from two to fifteen inches in diameter. Utilizing a four-position rotary table, GNX12PB can process up to twelve wafers at a time. Through the use of stainless steel end mills, diamond grinding wheels, and specially-developed lapping and polishing compounds, OKAMOTO GNX12PB is capable of producing superior wafer edge quality and providing maximum wafer process flexibility. A host of advanced control options, including pressure, speed and dwell control, are available to ensure highly accurate wafer polishing and predictable process repeatability. GNX12PB also includes an automated abrasive delivery unit with a robotically-controlled arm, along with a system of reverse-osmosis water filtration and recirculation. Combined with a top-mounted, pivoting vacuum cleaner and a centrifugal dust collection unit, OKAMOTO GNX12PB provides a truly clean work environment and high-quality process results. GNX12PB has many safety features, including a locked machine room, safety railings and emergency stops. It also has maintenance notification functions, providing a warning when a service is required and preventing any accidental operation until the device reaches the specified parameters. Additionally, the AGP CNC touchscreen controller allows for easy refinishing, reconditioning and maintenance of a wide range of processing parameters. OKAMOTO GNX12PB also features enhanced productivity and superior process results. With the two-position wafer carrier transfer machine, wafers can be automatically loaded and unloaded, resulting in increased processing time. A unique Wafer Autosensing Tool automatically detects the wafer thickness and adjusts the pressure and speed settings automatically, ensuring superior results with minimal effort. In conclusion, GNX12PB is a high-precision, automated asset designed to deliver superior wafer quality while meeting strict process repeatability requirements. Its advanced control options, automated abrasive delivery unit and top-mounted vacuum cleaner make it an ideal solution for wafer grinding, lapping and polishing.