Used OKAMOTO GNX12PB #293615575 for sale

OKAMOTO GNX12PB
ID: 293615575
Vintage: 2008
Grinding machine 2008 vintage.
OKAMOTO GNX12PB is a fully automatic Wafer Grinding, Lapping and Polishing equipment that offers high accuracy performance and flexibility. This system is ideal for precision processing of the most complex and challenging wafers. GNX12PB features a two-stage grinding, lapping and polishing process that ensures the highest level of surface finish and accuracy. The unit utilizes the latest generation of precision control technologies and advanced materials to achieve unparalleled levels of performance. OKAMOTO GNX12PB consists of a main unit and a wide array of tooling and accessories tailored to the specific needs of each process. The main unit contains a precision grinding head designed to accurately grind wafers to exacting specifications. The grinding head is equipped with a high-density abrasive material to provide minimal dust and maximum efficiency. The grinding head is then paired with the latest in robotic technology to enable precision production of the highest quality wafers. Following the grinding step, the lapping and polishing process begins in GNX12PB. This process utilizes a series of slurry baths and polishing wheels powered by an advanced robotic arm to provide a consistent, high-quality finish. Each lapping and polishing step is optimized for speed and uniformity, ensuring that all wafers are finished to exacting standards. Finally, the wafer processing is completed in OKAMOTO GNX12PB's cleaning machine. This tool helps to remove debris and contaminants from the wafers, leaving them with a pristine finish. All production steps are conducted in controlled environment clean rooms, ensuring consistent high-quality results. GNX12PB Wafer Grinding, Lapping, and Polishing asset offers the highest level of efficiency and quality. With its advanced technology and precision-engineered components, this model offers the highest level of performance and flexibility. The equipment's advanced robotic arm and high-density abrasive materials enable consistent production of the highest-quality wafers. With its optimised lapping and polishing process and integrated clean room environment, OKAMOTO GNX12PB is an essential tool for any wafer production process.
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