Used OKAMOTO GNX12PB #9135840 for sale

OKAMOTO GNX12PB Wafer Grinding, Lapping and Polishing equipment is a precision optical machining tool designed for use in the production of semiconductor devices. This precision machine is capable of polishing, lapping and grinding work pieces with a variety of abrasive materials, from coarse to fine grit sizes and in various contact angles. Its grinding head is designed with a potentiometer cyclic speed, to ensure a smooth and accurate grinding process. Manual grinding feed is also possible. The machine has a steady and reliable movement of the head, allowing precision cutting and polishing. It is well-suited for various material types, such as quartz, silicon and sapphire. GNX12PB Wafer Grinding, Lapping and Polishing system offers excellent precision, accuracy and repeatability. Its 12-inch grinding and lapping spindle is made of high-grade steel providing superior hardness and long tool life. Its moveable grindstone makes for quick and efficient polishing of wafers. The motor is equipped with a Servo-unit for high accuracy and speed control. The grindstone is controlled with a powerful stepper motor and manual control dial. OKAMOTO GNX12PB Machine has two modes of operation: low speed and high speed. With low speed, it grinds and laps from 0.04 um to 12 um at speeds ranging from 30 to 600 rpm. It has a maximum grinding speed of 1 m/s for high-precision applications. The high-speed mode provides up to 6000 rpm and a grinding speed of 25 m/s. The tool offers a number of safety features, such as safety door locks and grinding spindle protection locks. It also has a noise suppressor to reduce noise levels during grinding and lapping operations. The machine is also designed with an automatic oil cooling asset that helps to maintain temperature stability during grinding. GNX12PB Wafer Grinding, Lapping and Polishing model is a robust and reliable machine that is easy to operate, providing superior grinding and polishing capabilities and optimal processing results. It offers a great degree of accuracy, precision, and repeatability, making it an ideal choice for semiconductor device production.