Used OKAMOTO GNX12PB #9396515 for sale

OKAMOTO GNX12PB wafer grinding, lapping & polishing equipment is designed to process wafer substrates up to 300mm in diameter such as silicon, quartz, and ceramic. The system features a process chamber with two grinding/lapping/polishing heads that can be independently operated and activated simultaneously. The chamber is also equipped with a speed-controlled wafer holder, designed to keep the wafer in contact with the grinding wheels for precise grinding, lapping or polishing. There are a total of 12 air pressure-controlled grinding wheels, with adjustable speeds for each process. The grinding wheels are fitted with blades that can be exchanged to achieve different results from grinding, lapping or polishing. The unit utilizes an integrated Graph-X Controller/Operator panel, which includes an intuitive, menu-driven User Interface that can easily be configured for custom applications. The menu also provides process parameter and wax removal capabilities. The machine has a sensory machine to maintain precise temperature control within the chamber during all operations for consistent results. Additionally, thanks to its high-grade air filtration tool, GNX12PB ensures efficient wafer cleaning with no transfer of contamination. It has an exhaust asset with a vacuum chamber to ensure the clean-room environment is not contaminated during the processes. This high-end model stands out due to its superior accuracy, low running costs and reliability, making it ideal for wafer processing applications such as grinding, lapping, and polishing. OKAMOTO GNX12PB is also designed for easy maintenance and is constructed to withstand temperature and noise variations, making it suitable for automated production lines. It is an essential tool for grinding, lapping and polishing substrates with superior precision and accuracy.