Used OKAMOTO GNX8P #9135841 for sale

OKAMOTO GNX8P Wafer Grinding, Lapping & Polishing Equipment is a multifunctional solution for all grinding, lapping, and polishing needs. Utilizing a 6-inch diameter grinding and polishing plate, GNX8P is capable of processing up to 2,000 wafers at a time. Its integrated design helps to minimize overall grinding and polishing time and effort, ensuring a fast and efficient operation. The key components of the system include the grinding wheel, lapping platen, and polishing pads. The grinding wheel is a diamond-infused rotating disc that is adjustable for depth, enabling it to grind efficiently and accurately. The lapping platen uses abrasive compounds to effectively smooth the wafer through a series of movements. The polishing pads, on the other hand, use a fine mixture of abrasives to impart a smooth finish to the wafer. The unit also incorporates a number of advanced features, such as automatic wafer flipping, automated precision grinding and lapping, and a collimator to ensure accurate and precise positioning of the wafers. Its user-friendly design allows for easy operation, enabling operators to quickly set up and operate the machine. Additionally, its robust construction ensures precision performance even under high workloads. OKAMOTO GNX8P also offers an optional water-cooling tool that will help to keep the wafers cool during operations, thus helping to reduce thermal stresses on the wafers and preventing potential damage. In addition, its integrated data logger provides real-time feedback on wafer processing performance, enabling operators to make adjustments in order to ensure the best possible results. To sum it up, GNX8P Wafer Grinding, Lapping & Polishing Asset provides a comprehensive solution for grinding, lapping, and polishing needs. With its integrated design and advanced features, it ensures a fast and efficient operation with precision results.