Used OKAMOTO GNX8R #9396514 for sale

OKAMOTO GNX8R is a high-precision, flexible fabrication system designed specifically for wafer grinding, lapping, and polishing. This system uses its variable speed drive and large wheel capacity to provide highly precise wafer grinding, lapping, and polishing results. GNX8R has two wheel spindles that are connected by a hollow shaft. The wheel spindles are driven by a Fanuc AC servo motor that provides high-precision positioning and high speed operating capabilities, allowing for consistent and precise grinding, lapping, and polishing results. Both wheel spindles can be window controlled for precise machining accuracy. OKAMOTO GNX8R utilizes a large CNC-controlled wheel head, which allows for a range of versatile operations. The machine's maximum wheel size capability measures 300 mm in diameter, offering superior versatility. This feature also allows for the grinding of multiple material types. GNX8R can process materials such as ceramic , polysilicon, and wasp-cut chips, as well as other metal alloys. For efficient machining, OKAMOTO GNX8R incorporates a unique grinding method that simultaneously uses two wheel spindles. This feature allows the machine to finish grind a wafer on the first wheel, while polishing on the second wheel. This process reduces cycle times and increases productivity. GNX8R utilizes OKAMOTO own 3-step cycle which reduces exposure to contaminants and eliminates the need for a large amount of manual intervention. This is accomplished by first grinding, then lapping, and finally polishing. The 3-step cycle also ensures that the perfect surface finish is achieved. OKAMOTO GNX8R also features a high-efficiency dust collector that captures any airborne particles from the grinding and polishing operations. This aids in reducing the risk of contamination and potentially damaging debris. Additionally, a built-in coolant filtration system helps to ensure that the coolant is kept clean and that any contaminants are filtered out. GNX8R is an ideal choice for precision grinding, lapping, and polishing tasks. Thanks to its exceptional flexibility, precise machining abilities, and dust collecting capability; it is an excellent choice for fabricating various wafers in a variety of materials.