Used OKAMOTO Grind-X SPL15 #9406883 for sale

OKAMOTO Grind-X SPL15 is a powerful wafer grinding, lapping, and polishing system designed for use in wafer fabrication plants. This machine can process up to 15 wafers in separate stages, and each stage is fitted with advanced technology for maximum accuracy in wafer processing. Designed for precision, the advanced grinding technology ensures that the wafers are prepared with the highest possible quality standard. The grinding wheel is controlled by a powerful servo motor and equipped with multi-axis control and constant speed adjustment, allowing the user to accurately control the rotation and grinding speed of each wafer. Additionally, the grinding wheel is made of high-grade diamond and the surface is internally cooled to maintain the surface temperature at a desired level. The lapping process utilizes a unique multi-axis table and a vacuum chuck to secure and precisely position each wafer. The motion of the lapping table is accurately controlled, allowing the user to perform high accuracy grinding on wafer edges and surfaces. After the lapping process, the wafers undergo a polishing process, which can be set in single stage or multi-stage mode. This allows for surface finishing ranging from gentle buffing to high speed mirror-finishing. OKAMOTO patented Onset grinding technology is employed to give the wafers a gloss finish, enabling their optical characteristics to be accurately controlled and ensuring that their surfaces remain featureless and smooth. Finally, an adjustable vibratory tumbler is available which can be used for fast and effective cleaning of the finished wafers. In summary, Grind-X SPL15 is an advanced wafer grinding, lapping, and polishing system that can process up to 15 wafers and is equipped with advanced features such as a powerful servomotor, multi-axis control, and diamond grinding wheel, allowing for precision control of the grinding and lapping process.