Used OKAMOTO IGM 2M #9375276 for sale

OKAMOTO IGM 2M is a state-of-the-art wafer grinding, lapping and polishing equipment designed for performing high precision, mass production of semiconductor wafers. This system utilizes a unique grinding and polishing mechanism that combines diamond abrasive grinding and polishing tools, as well as precise pressure regulation to accomplish the desired shape and surface finish on finished product. The grinding and lapping process begins at the load station where the wafers are loaded into the machine one at a time. The grinding stage is where the wafers are ground into the desired shape and size based on the parameters supplied to the machine. The lapping process follows which uses a combination of diamond grains and lubricants in order to make sure the exact size and shape is achieved. The wafer polishing process is highly dependent on the accuracy of the machine. IGM 2M is equipped with a high-end alignment mechanism to precisely monitor the grinding and lapping process and make sure that the desired shape and size of the wafer are maintained as the polishing process takes place. This is achieved through a multi-level position detection technology that continuously adjusts the pressure control for a uniform polishing process across the entire wafer surface. Finally, the machine includes an advanced automatic cleaning unit that ensures that the entire process is clean and free of contamination. This machine utilizes a high-pressure, water-jet cleaning tool to thoroughly remove any debris from the wafers before they are packaged for shipment. Overall, OKAMOTO IGM 2M asset is an ideal solution for mass-production of wafers and is capable of providing highly accurate, efficient, and repeatable results. It is equipped with advanced features such as alignment systems, pressure control, and automatic cleaning model to provide a clean, time-saving process that meets the most demanding semiconductor requirements.