Used OKAMOTO KSK-Z2 #170020 for sale

OKAMOTO KSK-Z2 is a fully automated wafer grinding, lapping, and polishing equipment designed for high-precision wafers. It is designed for up to six-inch wafer sizes and is capable of producing perfect, flat surface finishes. The system is also suitable for surface mirror polishing and improving the electrical properties of samples. The automated control unit of KSK-Z2 ensures a high degree of process accuracy. The machine is equipped with a user-friendly touch-screen panel connected to the main machine controller. It offers settings for the various parameters of the grinding, lapping, and polishing process such as process speed, pressure, grinding direction, grinding cycles, and other parameters. OKAMOTO KSK-Z2 consists of three units. The first is the grinding unit, which consists of a platen and two grinding wheels. This unit grinds the wafer to the required aspect using precise step movements and height control. The grinding process is monitored by precise optical sensors which make sure the required accuracy is maintained throughout the grinding process. The second unit is the lapping unit. The unit consists of a rotating tool equipped with two precision diamond lapping discs which rotate against each other. This unit offers a high level of accuracy and surface quality. It is used to accurately shed particles of the wafer to the required depth and size. The lapping process is controlled by a precise control machine that ensures the required surface quality. The final unit is the polishing unit. This includes a large polishing plate that is driven by a drive motor. This polishing process works from rough polishing to smooth polishing. The polishing process is monitored by optical sensor, so that the required surface accuracy and mirror finishes can be achieved. During the polishing process, an additional cleaning process is also performed. This involves a cleaning rinse and a gun spray to remove the polishing slurry from the surface. KSK-Z2 is the ideal solution for precision grinding, lapping and polishing of wafers. Its precise control tool ensures a consistent finish, accurate results and optimal productivity. With its modern touch-screen panel it offers clear and easy user experience.