Used OKAMOTO OCG-2SA #9253103 for sale

OKAMOTO OCG-2SA is an automated wafer grinding, lapping, and polishing equipment designed to provide excellent uniformity and repeatability for a range of wafer sizes. The machine features a single-spindle spindle, a four-axis feed system, and a two-station work head. This state-of-the-art unit allows for higher productivity, improved quality, and longer maintenance intervals for all applications. The machine features a built-in full programming capability and modem-equipped CNC unit, which allows for full control of the entire process. It is capable to automatically change spindles, grind sizes, and speeds to ensure the most precise and efficient grinding results. An automated lapping and polishing control machine provides uniform and accurate finishing. The tool also features an on-board X-Y-Z measurement asset and is capable of auto-aligning the wafer in the machine. OCG-2SA is equipped with an automated grinding wheel changer,which allows for quick and easy access to different wheel configurations. The machine can also handle multiple wafer sizes and thicknesses. It is equipped with a high-performance grinding wheel that offers high speed as well as outstanding quality tolerance and low-temperature cutting. OKAMOTO OCG-2SA provides users with a high cycle-time through the use of its advanced spindle control model. The advanced control of the spindle ensures fast, uniform, and accurate grinding. The equipment also offers the capability of feeding wafers through the machine in a continuous and accurate manner. In addition, the machine is equipped with an integrated dust collection system to ensure a clean working environment. The precision and reliability of OCG-2SA unit allows for high yields and cycle times. The single-spindle spindle, four-axis feed machine, and two-station work head enable the tool to grind through the entire wafer in one continuous process. The superior grinding and polishing performance, combined with the high cycle time, enable users to reduce their costs by eliminating costly shutdowns due to wafer breakage or contamination. In conclusion, OKAMOTO OCG-2SA is a superior, automated wafer grinding, lapping, and polishing asset. It provides users with excellent uniformity and repeatability while also providing efficient grinding and polishing. The model is equipped with advanced features such as a spindle control equipment, multi-wafer handling capabilities, and an integrated dust collection system to ensure a clean working environment. As a result, OCG-2SA gives users the ability to reduce downtime and costs while producing superior quality wafers.