Used OKAMOTO PFG-350DX #170036 for sale

ID: 170036
Vintage: 1993
Grinding machine, 1993 vintage.
OKAMOTO PFG-350DX 'Wafer Grinding, Lapping and Polishing' equipment is an automated production line designed to deal with a variety of materials, including but not limited to, glass, semiconductor, and hard materials. Specifically, it provides a powerful grinding and lapping process to achieve a high accuracy and quality surface finish on wafers. PFG-350DX system works through a five stage process, beginning with a rotary grinding wheel and truing the surface of the wafer to prepare it for additional polishing. The unit then moves on to lapping the material, using a combination of abrasive belts, discs, and pastes to lap the material until it meets the specified surface finish. The abrasive material used for lapping is made of diamond or garnet and is available in various sizes and angles. The third stage is high precision polishing, which is achieved through the application of abrasives in a finely tuned process to reach a consistently smooth surface finish. The fourth stage is buffing to further smooth the surface by removing any remaining surface imperfections, and finally the machine moves to a fifth and optional stage of "multi-level polishing", further extending the level of accuracy achieved. OKAMOTO PFG-350DX tool is automated, meaning that all grinding and polishing is done by machine and accurately monitored by a sophisticated control asset. This helps achieve a highly accurate, high quality wafer finish time after time. It is also designed to be extremely reliable and safe, with features that allow for easy maintenance and replacement of parts, so that the model performs as expected, without any unscheduled downtime. Overall, PFG-350DX is an extremely useful and accurate equipment for providing high quality, precision finishes to a wide range of materials. It is the perfect solution for any production lines that need to achieve a consistent, precise wafer finish time after time, and is a reliable and accurate partner in any wafer grinding, lapping, and polishing process.
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