Used OKAMOTO PFG-450DXB #170065 for sale

ID: 170065
Vintage: 1995
Grinding machines, 1995 vintage.
OKAMOTO PFG-450DXB is a top-of-the-line wafering grinding, lapping and polishing equipment characterized by its sophisticated design, precision technology and high-quality components. It is a three-axis system with a diamond-based grinding and polishing head that allows the user to achieve desired topographical surfaces on the material being processed. The unit is designed to perform precision surface grinding and polishing of various ceramic, silicon, non-oxide and oxide materials, such as single-crystal silicon wafers, quartz, glass and other related materials. It is also suitable for lapping of highly precise, precision-polished substrates. The three axes machine of PFG-450DXB is powered through servo motors located in the base of the unit. The maximum grinding/polishing speed is 12mm/s and it can be adjusted according to the material and the desired surface finish. The tool has a working area of 320mm in diameter and 25mm in depth. The grinding and polishing head of the asset consists of a main body, grinding electrodes and a fine polishing pad. The main body holds the diamond grinding and polishing electrodes and holds it in place. The diamond electrodes are composed of very fine diamond particles embedded in an electrically conductive disc and are precisely ground to size and shape to achieve the desired topographical surface. The electric potential of the diamond electrodes is adjustable according to the material, allowing the user to obtain an optimal finish. The polishing pad is made of a soft, durable material, allowing a fine polishing finish. OKAMOTO PFG-450DXB is equipped with an intelligent controller, allowing the user to program and automate processes and tasks. The user can also monitor the entire process with the 3D real-time visualization and process records. The model is also equipped with safety systems, including a lid interlock equipment and an emergency stop button. PFG-450DXB is a highly precise and precise, high-performance wafer grinding, lapping and polishing system, designed to meet the needs of all types of engineering and production applications. It offers precise, repeatable, and automated processes while ensuring high-quality and consistent results.
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