Used OKAMOTO PFG-612 #170041 for sale

OKAMOTO PFG-612 is a highly advanced and precise model of wafer grinding, lapping, and polishing equipment. This technology is used to refine the surface finish of semiconductor wafers or other materials that require polished surfaces for further fabrication. The grinding, lapping, and polishing process is designed to produce consistent and uniform ultra-fine surfaces on the wafer. PFG-612 is a high-performance system, boasting a compact design with a footprint of approximately 2.2 meters by 4.7 meters. This wafer grinder possesses a high degree of automation, featuring a set of abrasive wheels for the grinding process, a polishing wheel for magnetic and electrolytic polishing, and a substrate holder for the lapping process. The grinding wheel of OKAMOTO PFG-612 unit is mounted on an adjustable spindle and mounted to a bed plate that allows it to rotate at speeds up to 1800 rpm. This wheel utilizes diamond particles with a narrow particle size distribution as the cutting media to achieve high precision surface finishes. The wheel is also mounted to a slide rail with a versatile 15-axis grid pattern allowing better control over the grinding process. The dosing pump machine affords greater control over the supply of lubricants and abrasive particles to the wheel. The polishing wheel of PFG-612 tool is also adjustable and comprises a static platform and a turning disc fixed to the platform. This wheel is designed to carry out magnetic and electrolytic polishing and is easily adjustable to produce a wide variety of surface finishes. The asset also features a substrate holder for the lapping process. This holder is designed to secure the substrate and guide it accurately in the desired direction for consistent results. OKAMOTO PFG-612 model is the ideal solution for process engineers looking for an efficient and precise wafer grinding, lapping, and polishing equipment. Its advanced level of automation ensures that wafer surfaces are consistently refined in order to achieve the desired surface finish. Whether seeking to produce ultra-smooth surfaces on wafers or achieve a desired roughness, PFG-612 system is able to deliver the desired results.