Used OKAMOTO PRG-6 #200286 for sale

Name: OKAMOTO PRG-6
Brand: OKAMOTO
SKU: 200286
Availability: InStock

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Wafer Grinding, Lapping & Polishing

Manufacturer

OKAMOTO

Model

PRG-6

ID: 200286

Vintage: 1987

Rotary surface grinding machine Diameter of magnetic chuck: 24" Maximum swing inside coolant guard: 28" Standard wheel size: 14" x 1.5" x 5" hole Maximum height to center of wheel: 15" Wheel elevation by hand or power Maximum angle-concave or convex: 3 degrees Table speeds: 30 - 100 RPM Table travel, maximum: 16" Table travel rate: 0 - 15 FPM Variable magnetic chuck control Hydraulic wheel guard dresser 10 HP spindle drive motor 3 HP hydraulic system motor Table trip dogs Coolant tank & pump Splash guarding 1987 vintage.

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OKAMOTO PRG-6 is a fully automated high-performance precision wafer grinding, lapping, and polishing equipment. This wafer fabrication system has been designed to accurately process front and backside surfaces of single-side or double-side wafers. It is capable of achieving precise flatness for high accuracy, precision and uniformity. PRG-6 is equipped with a compact grinding, lapping and polishing head. This head features an XY-axis simultaneous grinding, lapping, and polishing mechanism. This ensures precise flatness with a high level of accuracy. The head is capable of grinding at a high speed while maintaining precise flatness and lapping with a precise angle. It is also able to provide precise polishing. OKAMOTO PRG-6 also includes a wafer pre-treatment unit. This unit ensures the wafer is clean before it is processed by the grinding, lapping and polishing unit. It features a spin drying unit and wet and dry cleaning process. This ensures the wafer is free from contaminants and is ready for processing. PRG-6 also features a computer control machine. This tool provides precise control over all processes. This includes the wafer pre-treatment, grinding, lapping, and polishing. It also allows for exact settings for each step of the process. OKAMOTO PRG-6 is capable of processing to a sub-micron level accuracy. The asset is capable of producing single-side and double-side wafers with planar, reflective surface finish. PRG-6 also features high-efficiency and low heat generation during the processing. OKAMOTO PRG-6 is a high performance, fully automated wafer grinding, lapping & polishing model. It is equipped with a compact grinding, lapping, and polishing head with XY-axis simultaneous grinding, lapping and polishing. This ensures precise flatness with a high level of accuracy. PRG-6 also features a wafer pre-treatment unit and computer control equipment for precise control of each step of the process. The system is capable of producing single-side and double-side wafers with a planar, reflective surface finish to a sub-micron level of accuracy.