Used OKAMOTO PSG-355EXZ NC #9395046 for sale

OKAMOTO PSG-355EXZ NC
ID: 9395046
Surface grinder.
OKAMOTO PSG-355EXZ NC Wafer Grinding, Lapping and Polishing Equipment is a multifunctional system that can perform grinding, lapping and polishing operations on a variety of materials. The unit can accommodate wafer sizes of up to 10.4"xdiameted and up to 3" high. The unique design of PSG-355EXZ NC provides maximum flexibility in the configuration and positioning of the grinding and polishing components. This machine uses a standard 40hp AC motor and a spindle speed of up to 3000 RPM. It has a variable speed range between 900-3,000 RPM and can grind, lap and polish metals, semi-conductors, glass and ceramics. The grinding arm of the unit can be moved across the wafer and the adjustable chuck houses the wafer up to 10.4" in diameter and 3" in height. This allows for precise control of the grinding and polishing process. In addition, OKAMOTO PSG-355EXZ NC has an adjustable speed control and a centrifugal force adjuster that allow for fine adjustments of the material being machined. The precision fine control of the grinding and polishing process ensures that a high quality finish is achieved. With its multi-functionality,theOKAMOTO PSG-355EXZ NC is able to grind, lap and polish a wide range of materials with a high degree of accuracy. In order to maintain its superior results, the tool is operated using a specially designed, self-contained hydraulic unit. This unit utilizes a vacuum unit to minimize waste fluid and debris and the hydraulic pump drives the wafer grinding, lapping and polishing components at the required speeds. Furthermore, theOKAMOTO OKAMOTO PSG-355EXZ NC is equipped with a coolant asset which further enhances the quality of the finished product. The unit can run either dry or wet depending on the application. TheOKAMOTO PSG-355EXZ NC is an ideal solution for companies requiring the precision and accuracy necessary to produce top-quality parts. It combines high efficiency and reliability with the latest technology to create the most effective wafer grinding, lapping, and polishing model available.
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