Used OKAMOTO PSG-408DXNCZ #9395045 for sale

OKAMOTO PSG-408DXNCZ is a fully automatic, state-of-the-art wafer grinding, lapping and polishing system. Using the latest in abrasive technologies, it is designed to provide uniform and precise lapping and grinding of all types of semiconductor, flat panel, display and other precision glass substrates. It is capable of surface roughness Ra values of 1 nanometers (nm) and a maximum wafer size of 8 inches (203.2 mm). This system comes equipped with a full automatic loader/unloader servo drive, eight separate grinding/polishing stations, two aggressive lapping stations and two polishing modules. The dedicated servo drive allows for smooth operations with minimal noise levels. The eight grinding/polishing stations are designed to provide a high level of accuracy and precision for grinding and polishing. The two aggressive lapping stations are designed to prep glass substrates through the use of diamond impregnated, abrasive film. The polishing modules are designed to reduce surface roughness on glass substrates while achieving high precision and excellent repeatability. In addition, PSG-408DXNCZ can be integrated with a variety of data acquisition systems, including data acquisition package, connectivity and Windows-based graphical user interface. Through this interface, users are able to access real-time performance, process control, and feedback. Operators can create customized process programs to share between systems, as well as automatically store, retrieve and compare lapping and polishing results. The microprocessor-controlled thyratron and solid-state pressure control modules maintain a constant pressure on the grinding/polishing material, ensuring the highest rates of grinding/polishing and the most consistent results. All of the individual process parameters can be adjusted using touch-screen parameters to achieve optimum repeatability and precision grinding/polishing results. The fully automated system is capable of both single and series processing of up to 400 wafers in a single batch. Additionally, all of the process results are automatically stored for future reference and statistical analysis. The advanced design and manufacturing of OKAMOTO PSG-408DXNCZ makes it the ideal choice for precision grinding and polishing of virtually all types of glass substrates.