Used OKAMOTO PSG-52DX #9395043 for sale

OKAMOTO PSG-52DX is a wafer grinding, lapping and polishing equipment designed to provide precise control and consistency on wafer production lines. It is a fully automated system that uses a three-step process to grind, lap and polish wafers. Firstly, the wafers are loaded into a workholder and transferred to the integrated load station where the grinding/lapping process takes place. This process starts with super abrasive grinding wheels to ensure accuracy of cut profiles and surfaces. The grinding wheel is driven by a brushless DC motor with a servo drive that optimizes the grinding parameters and provides the desired surface finishes. Depending on the material and application, different speed ranges can be chosen to obtain the desired performance. Second, the lapping operation is performed using a lapping wheel to create a highly precise surface and profile for the wafer. For this, the grinding wheel is replaced by a lapping disc that is rotated by a brushless DC motor and a highly precise feedback unit that maintains a consistently flat surface. The lapping wheel is adjustable, allowing the operator to adjust the speed and size of the lap to match the surface finishes being achieved. Last of all comes the polishing stage. This uses an abrasive slurry and a flexible pad to achieve the desired surface finishes. This process is highly adjustable and allows operators to fine-tune the speed, pressure and slurry concentration for optimum results. This will ensure that the wafers have a consistent finish without any marking or defects. PSG-52DX is a powerful and efficient tool that comes with a number of features that allows operators to monitor and improve the processes. It has a comprehensive touch screen control panel that provides feedback on the grinding, lapping and polishing process, and includes the ability to input exact parameters for each step. This makes it easier to get the best possible results whilst saving time and money. OKAMOTO PSG-52DX is a valuable tool for wafer production lines and is well suited for applications that require a high degree of accuracy and quality. It is an excellent choice for those looking for an efficient and reliable fully automated wafer grinding, lapping and polishing machine.