Used OKAMOTO PSG 63 DXNCZ #9185085 for sale

OKAMOTO PSG 63 DXNCZ is a wafer grinding, lapping, and polishing equipment designed to enable high precision surface finishing for a wide range of applications. This system features an advanced grinding head design with two grinding spindle speeds and a counter balance mechanism that ensures low noise and vibration during grinding operations. The grinding head also features an automatic spindle speed control and a speed display panel with guard function, enabling precise grinding. The grinding surface can be freely adjusted via a manual hand-wheel unit, allowing for accurate surface finish on various materials. The grinding is powered by a 4 kW AC motor with options for a powerful 6kW motor, allowing for variable speed control. Additionally, the grinding head has an adjustable depth stop, allowing for precise grinding of both standard and custom surfaces. The grinding head is also equipped with double flanges that ensure perpendicularity of the grinding wheel during operation, providing an even and consistent result. In addition to grinding, PSG 63 DXNCZ also has the capability for lapping and polishing. An integrated lapping table allows for simple and fast surface lapping with minimal downtime. Additionally, the lapping table is equipped with soft and hard durable pads, enabling optimal material removal without risk of damage. The polishing process utilizes a variable speed polishing spindle combined with a tangential or rotation polishing head, offering a variety of surface finishes. This machine is also equipped with a polishing compound container and a vacuum tool for dust removal. To ensure maximum throughput and efficiency, OKAMOTO PSG 63 DXNCZ is also equipped with a cooling asset and an automatic filter model. The cooling equipment helps reduce temperatures in the grinding head and in the grinding area, while the filter system helps recycle used grinding, lapping, and polishing liquids. PSG 63 DXNCZ has been designed to provide a simple and efficient grinding, lapping, and polishing solution for any application. The unit is designed with the latest technological advancements and features an advanced grinding head for precise surface finish. The integrated lapping table and polishing unit are designed to ensure maximum efficiency and accuracy, making OKAMOTO PSG 63 DXNCZ the perfect choice for any wafer grinding, lapping, and polishing requirements.