Used OKAMOTO PSG125DX #9375272 for sale

OKAMOTO PSG125DX is a powerful and precise wafer grinding, lapping and polishing equipment that can be used for a variety of material processing applications. The unique two-stage feature of the system allows for the capability to perform both grinding and lapping simultaneously, providing exceptional control and precision. The unit is equipped with diamond-resin grinding wheels and an external water supply for cooling and flushing. This machine is also designed with a zero-force delivery table that can freely move the polishing head without the need for a separate lift mechanism, providing users with increased visibility and control over the entire process. PSG125DX also features automatic programmable grinding and polishing functions, allowing for a predetermined sequence of processing operations to be repeated with different wafer sizes without requiring the user to manually adjust parameters each time. The two-axis motor-driven motion control tool of the machine ensures repeatable accuracy, allowing for excellent control and precision. Additionally, the asset is equipped with a user-friendly LCD touchscreen display that displays grinding and lapping conditions, creating an intuitive and easy-to-understand interface for users. OKAMOTO PSG125DX utilizes a sophisticated closed-loop spindle motor for high grinding accuracy, allowing for smooth processing with absolutely minimal fumes. It is capable of handling materials with a wide range of hardness, ranging from aluminum to titanium alloys, rapidly and efficiently. The dual spindle of the machine is designed with a balancing-axis model that automatically adjusts and maintains parallelism and balance even with heavy and extreme loading. This equipment also offers optimum convenience to users, thanks to its portability and the capability to be integrated and upgraded with a wide range of accessories and options that are available. PSG125DX has an integrated wafer loader, allowing users to quickly and instantly load up to 50 wafers for processing without the need for manual labor. Its features and specifications make it an ideal choice for users who require highly precise and efficient grinding, lapping and polishing operations.