Used OKAMOTO PSG155DX #9375274 for sale
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ID: 9375274
Surface grinding machine
Chuck size: 1500 x 500 mm
Electromagnetic chuck
Water injection tank with separator.
OKAMOTO PSG155DX is a wafer grinding, lapping and polishing equipment designed for high precision wafer processing. This system provides precise abrasive machining and produces superior flat wafers that meets demanding requirements, at a flatness and surface finish that eliminates costly rework or scrapping. This machine consists of three basic processing units—grinding, lapping and polishing—each with its own redundant capabilities to ensure uniform results. The grinding unit is equipped with two variable speed spindles, each with independently adjustable rotational speeds, allowing for precise selection of finishes, ranging from non-directional matt surface to ultra-smooth optics quality. The spindles also feature load sensors to monitor and respond to changes in the workpiece during machining. The lapping unit is the heart of the unit, consisting of two independent loaders and polishers with smooth movement throughout the entire work cycle. Each polisher has two plates, one for abrasive polishing and one for a smooth surface finish. The pressure applied by the lapping plates is adjustable, allowing for the control of the tolerances needed for high-precision working. The plates are made of durable polyimide, allowing for use with different abrasive sizes. Finally, the polishing unit allows for high surface finish, taking into account the unique characteristics of the material being machined. A variety of abrasives are available for polishing, permitting customized settings to achieve the optimum levels of surface smoothness and clarity. This unit also has load sensors to monitor changes in the workpiece, allowing for more precise control of loads and angles. In conclusion, PSG155DX is a well-developed and advanced grinding, lapping and polishing machine designed to provide superior performance. This machine features state-of-the-art motors, sensors, and materials to ensure optimal performance and accurate results in a wide range of wafer processing applications. With its versatile processing capacity, this tool will help achieve the highest possible quality results.
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