Used OKAMOTO PSG157DX #9375275 for sale

OKAMOTO PSG157DX is an automated wafer grinding, lapping, and polishing equipment designed to provide high-precision and high-speed performance. This system is capable of producing highly accurate wafer surfaces and can be used in a wide range of industrial application. It uses two 5Å diamond grinding wheels that rotate at high speed, providing a high-precision finish. The automatic feed unit allows the grinding process to be controlled precisely and quickly, while the axis and spindle configurations provide an optimal grinding and lapping force. The machine also features an automatic touch-off tool, which helps achieve high repeatability of the spindle head positioning. PSG157DX's automatic lapping process uses two separate 6Å diamond discs, one for roughening and one for polishing. This ensures maximum accuracy and repeatability when lapping wafers. The lapping process is also aided by the presence of an optically-controlled automatic dressing asset. This model employs a specialized laser to accurately control the dressing of the lapping discs while ensuring consistent surface quality. The equipment's polishing capabilities are operated using two electroplated diamond polishing pads. These pads provide mechanical and chemical polishing options for various materials while ensuring a uniform finished surface. The Automatic contact recognition system enables the polishing pads to be used in any orientation without creating artifacts on the surface finish. OKAMOTO PSG157DX is a reliable and highly precise unit excellent for a variety of wafer grinding, lapping, and polishing applications. Its robust construction provides a stable platform to achieve consistent surface finish and is also able to handle larger wafers with ease. The sophisticated automatic feed machine, optically-controlled dressing tool, and automatic contact recognition asset helps to create repeatable, highly-accurate results time after time.