Used OKAMOTO PSG65DXNC #9375271 for sale

OKAMOTO PSG65DXNC is a powerful wafer grinding, lapping and polishing equipment designed for high accuracy and efficiency in the production of semiconductor wafers. This system is well-suited for production line processing of wafer surfaces of various sizes, and offers advanced features and functions, enabling users to process their product by creating a precisely symmetric surface finish. The unit is centered around a fully programmable CNC grinding head with a 5-axis control machine. The CNC grinding head incorporates a handwheels for manual operation in rough cuts. This tool also includes a computerized XYZ measuring and drill machine, as well as a set of grinding wheel belts. Each grinding wheel belt is adjustable to a range of sectors, allowing for a variety of patterns and surface finishes. Additionally, the wheel belts can be interpolated for extra precision and accuracy. The asset also features variable speed polishing and grinding heads that provide a superior surface finish and can be matched to the user's exact requirements. The polishing head incorporates two independent work areas with an adjustable pitch angle, allowing for flexibility in controlling the polishing surface. This model is also equipped with a range of spindles, ensuring that the highest quality surface finishes can be achieved. Furthermore, the equipment incorporates a diamond lapping disc for removing imperfections from the surface of the wafer and creating an ultra-precise flatness. This unique lapping process is based around the use of a laser scanning system and a particle accelerator that maximizes the effect of the diamond lapping disc. Finally, the unit includes a range of optional accessories, such as transport modules, granular media supplies, and digital measuring systems, as well as a full library of software tools needed for process optimization and control. In short, PSG65DXNC is a sophisticated and powerful wafer grinding, lapping and polishing machine that offers precise surface finishes with options for optimal process control. Its range of versatile features and modular design provide users in the semiconductor industry with the ultimate precision and reliability when it comes to wafer processing.