Used OKAMOTO / SHIBAYAMA VG 502 MK II 8 #293639465 for sale

OKAMOTO / SHIBAYAMA VG 502 MK II 8 is a precision wafer grinding, lapping and polishing equipment, designed for use in semiconductor production and related applications. This system combines advanced grinding and polishing technology with precision control and high-end features that ensure perfect results every time. OKAMOTO VG 502 MK II 8 features a powerful 9.75 kW spindle motor, which offers unprecedented performance when grinding, lapping and polishing wafers. The spindle is made of high-quality components, such as a large-diameter cast steel body and hardened steel spindles to ensure precision, accuracy and increased rigidity. An automatic spindle speed control unit allows the user to quickly adjust the speed to the desired level. The integrated integral oil-mist cooling device reduces temperature and increases spindle life. SHIBAYAMA VG 502 MK II 8 also offers a large grinding table, allowing for longer stroke lengths and a larger amount of space for grinding larger wafers. It is equipped with a range of grinding wheels and diamond tools, as well as abrasive and polishing products for a wide range of applications. The machine also comes with a host of safety features, including automatic energy shutoff in case of accident, over-temperature alarms, cumulative total run time indicators and others. VG 502 MK II 8 also offers a comprehensive array of digital tool control functions. It is equipped with a single-board computer and graphical user interface, allowing the user to set grinding, lapping and polishing parameters, view real-time operation status, and diagnose potential problems. In summary, OKAMOTO / SHIBAYAMA VG 502 MK II 8 provides advanced grinding, lapping, and polishing technology, as well as a range of advanced safety and digital control functions. This asset delivers reliable and accurate results, and is designed for a variety of semiconductor production and related applications.