Used OKAMOTO / SHIBAYAMA VG 502 MK II 8 #293639467 for sale
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OKAMOTO / SHIBAYAMA VG 502 MK II 8 Wafer Grinding, Lapping & Polishing Equipment is a multi-function system designed for precision processing of large and small semiconductor wafers. The unit combines high speed grinding, lapping, and polishing with advanced low vibration technology. The machine operates with high accuracy and repeatability, creating smooth surface finish on wafers of all sizes. OKAMOTO VG 502 MK II 8 features a heavy duty cast base and Y-axis, enabling smooth, stable and noiseless operation. The advanced microprocessor control tool, combined with the asset's low vibration design and high precision spindle, results in accurate grinding, lapping and polishing. The model has a dynamic drift control, forcing the operator to keep the tool in the work-piece center. The equipment can be configured for many different uses, for example grinding, lapping and polishing. The double speed features allow for operation at different speeds and pressures, optimizing processing and producing consistent surface finish. The polishing head has a constant speed option, while the spindle speed can be programmed with a knob on the controller. The system is equipped with a dust collector hood to protect the operator and the environment from dust generated during grinding, lapping and polishing. The unit is designed to ensure excellent accuracy and repeatability, with minimal losses and reductions in energy consumption. SHIBAYAMA VG 502 MK II 8 is suitable for wafers up to 200mm diameter and 0.5mm thickness. It is designed for high precision and high extractability processing of hard to reach areas, with a minimum of operator interference. The machine is well suited for production purposes, and delivers excellent quality results.
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