Used OKAMOTO / SHIBAYAMA VG 502 MK II 8 #293647678 for sale

OKAMOTO / SHIBAYAMA VG 502 MK II 8 is a high performance wafer grinding, lapping, and polishing equipment designed for ultra-fine accuracy requirements. Equipped with powerful spindle motors, diamond wheels, and advanced abrasive techniques, this system is ideal for grinding and polishing wafers for advanced semiconductor and MEMS applications. The unit features a rugged CNC spindle motor capable of delivering incredibly high torque and speeds up to 70,000 rpm, which can efficiently and accurately grind and lap wafers to a surface roughness of 2 microinches (0.05 micrometers) or better. This ensures high-precision and consistency across the entire grind-lap cycle, making it ideal for producing high-end electronics. The spindle motor is complemented by a sophisticated abrasive machine. This includes a wafer chuck that holds the wafer securely in place and moves it in the X-, Y-, and Z-axes as required. The chuck is also equipped with a built-in cooling tool to prevent overheating during grinding and lapping operations. The asset also features several high-precision diamond wheels of various grit levels, providing a wide range of grinding and lapping operations. OKAMOTO VG 502 MK II 8 comes with sophisticated control and automation capabilities. Its advanced programming language allows users to input parameters such as grinding and lapping speed, dwell time, number of cycles, and other parameters. Its robotic arm and X-servo support provide precision and repeatability across the entire cycle, ensuring consistent results. Finally, the model is designed with safety in mind. Its dust extraction equipment captures metal particles during operations and its closed-loop coolant delivery system protects the grinding and lapping wheels from contamination. The unit also features a non-contact monitoring machine to identify hazardous dust accumulation and alert the user accordingly. Overall, SHIBAYAMA VG 502 MK II 8 wafer grinding, lapping and polishing tool is a robust, high-precision solution that can handle a variety of grinding and lapping operations quickly and efficiently. Its sophisticated design makes it ideal for advanced semiconductor and MEMS applications.