Used OKAMOTO / SHIBAYAMA VG 502 MK II 8 #9223302 for sale

OKAMOTO 8 VG 502 MK II is a professional-grade wafer grinding, lapping, and polishing equipment. This high-quality, comprehensive system is designed for the precise grinding, lapping, and polishing of semiconductor wafers within a wide range of production levels, from research and development and low volume to mass production. The VG 502 MK II is equipped with two built-in motors - one for grinding and lapping and the other for polishing. It features a unique adjustable chuck that easily accommodates wafers of up to 8-inches in diameter. This provides outstanding performance in die manufacturing and substrates that don't require very precise grinding, lapping, and polishing results. The VG 502 MK II also features a spindle head with four spindles that are independently controlled. This allows for a wide range of operations, allowing a high degree of flexibility, and a wide variety of geometric patterns can be processed. The spindle head's servo unit uses a frame construction that facilitates superior grinding quality by using natural balancing and precise weight placements. The machine's vertical guide master allows for straightforward, fine adjustment of the grinding and lapping wheel. This makes it simple and easy to obtain consistent results with minimal downtime. The operation is further enhanced by a convenient control panel that is equipped with an LCD display and a self-diagnosis function. The VG 502 MK II offers a range of accessories, such as wheels, tables, measuring devices, various types of chucks, etc. It also features a range of options, such as higher grinding speed, an optional optical grinding tool for superior results, and a pulse feed asset that further improves the grinding results. In addition, the VG 502 MK II is designed to be compact and easy to maintain. It incorporates a number of security measures, such as a digital control model and an enclosure to protect the operator from any dangerous particles. Finally, for additional information, a comprehensive user manual and customer service are available to ensure hassle-free operation. Overall, SHIBAYAMA 8 VG 502 MK II is an ideal wafer grinding, lapping, and polishing equipment to meet a wide range of demands. With its many features, maximum flexibility, automated processes, reliability, and easy maintenance, it can provide tremendous production values for a wide range of tasks.