Used OKAMOTO / SHIBAYAMA VG 502 MK II #9219357 for sale

OKAMOTO / SHIBAYAMA VG 502 MK II is a state-of-the-art wafer grinding, lapping, and polishing equipment made for precision wafer and optics fabrication. OKAMOTO VG 502 MK II is based on a three-stage grinding and polishing system, consisting of an 8 inch diameter rotating platen, a variable speed rotating lapping arm, and a table-mounted polishing pad. First, the wafer material is placed on a stationary bottom plate, and the rotating platen holds the wafer material against it as it rotates. This bottom plate can be adjusted to a number of different angles, allowing for both imprinting and edge grinding to be done at the same time. The 8 inch platen is driven by an adjustable speed timer, and can rotate from 0-180 RPM. Second, the variable-speed lapping arm is then used to polish the wafer. It is affixed to the platen and can be extended outward to complete polishing and grinding of metal and other wafer materials. The arm can be adjusted from 0-1800 RPM, allowing for polish up to 400 angles per minute. Finally, the wafer is then placed on a table-mounted polishing pad. This pad is adjustable, allowing for a consistent finish on both sides of the wafer, as well as the edges. The mounted pad holds a polishing compound (water, oil, slurry) which is used to achieve the desired finish. A timer unit sets the duration for the polishing process. In addition, a vacuum machine between the polishing pad and the table allows the dust created by polishing to be removed in a contained manner. Overall, SHIBAYAMA VG 502 MK II is an exceptional wafer grinding, lapping, and polishing tool. With its adjustable speeds and angles, VG 502 MK II allows for precision grinding and polishing of wafer materials, allowing for a consistent and precise finish. In addition, its dust extraction asset ensures efficient and safe removal of any particles created during the process. This allows for quick and consistent polishing of wafer materials, ensuring a premium end result.