Used OKAMOTO SiG154H/SiS152H #9101452 for sale

OKAMOTO SiG154H/SiS152H is a wafer grinding, lapping and polishing equipment specially designed for the production of superior quality articles. This system is designed for the polishing and lapping of very small wafers, such as those used in microelectronics, to achieve superior levels of accuracy and surface finish. The high precision Spindle Head, using a powerful DC motor, enables full control of grind and polish parameters, allowing the user to precisely adjust grinding and polish pressure, rotation speed, and down feed rate. The Spindle Head also features lower and upper bearing assemblies that guarantee accurate grinding, lapping and polishing at all times. OKAMOTO SiG154H/SiS152H features a very precise Table Control Unit that allows the user to adjust the X direction of the wafer stage manually or by utilizing the fine positioning wheel. The Y direction of the wafer stage can also be adjusted manually by the user, creating the exact conditions needed to achieve the most many challenging manufacturing processes. The precision grinding/lapping arm features the exclusive OKAMOTO drive machine that is designed to achieve a higher level of accuracy and repeatability. The Grinding/Lapping arm also includes a fully adjustable grinding wheel, down feed pressure gauge, a wafer stage lift mechanism and a honing device that can be used to further enhance the polishing process. In addition, OKAMOTO SiG154H/SiS152H is equipped with a powerful Dust Collecting and Exhausting tool that ensures complete and efficient exhaust of any dust particles that are created during the grinding, lapping and polishing processes. This asset reduces airborne particles in the working environment, creating a more comfortable and safe environment. Finally, OKAMOTO SiG154H/SiS152H is equipped with a PC interface that allows the user to manage and configure the entire model. This allows the user to create unique grinding/lapping and polishing recipes, create detailed machine logs, and carry out detailed analysis of the results. In conclusion, OKAMOTO SiG154H/SiS152H is a highly precise and efficient wafer grinding, lapping and polishing equipment that has been designed to satisfy the most demanding requirements of the microelectronics industry. It is equipped with features such as a powerful Spindle Head, Table Control System, Grinding/Lapping arm and Dust Collecting and Exhaust Unit, as well as a PC interface that makes it easy and convenient to manage and configure the machine in order to achieve the desired results.