Used OKAMOTO SPP-600S #9078428 for sale

OKAMOTO SPP-600S is a geometrically-controlled wafer grinding, lapping and polishing equipment designed for the flat processing of semiconductor wafers and other thin-film materials. The system combines precision micro-grinding, lapping and polishing processes into a single, automated unit to produce ultra-flat, highly-polished wafers, with extremely tight flatness tolerances. Using SPP-600S, wafer grinding, lapping and polishing processes are controlled precisely by a CCD camera with automatic adjustment of the table. This uniformity control machine is capable of maintaining an extremely tight σ-flatness of .2 μm or better depending upon the type of wafer and the lapping and polishing conditions used. Automated wafer separators ensure that lapping and polishing forces are evenly distributed, producing very uniform and consistent results. The tool is designed with a sophisticated process control and monitoring asset, which utilizes a specialized PC-based software program to control the critical parameters such as tool speed, diamond concentration, operational pressures, temperatures and more. This control feature enables operators to accurately and easily set up a large variety of product specific process recipes, and then maintain them with a consistent and repeatable output result. The grinding/lapping process on OKAMOTO SPP-600S is capable of removing a large number of defect sites, including micron-size particles and contaminants, thereby allowing for superior surface finish. The model can process single or a variety of substrates, including polysilicon and single-crystal materials. In addition, the equipment provides automated wafer chucking, wafer inspection and remove-andreplace operations, along with an automatic cleaning system to quickly and efficiently remove debris from the lapping disc. SPP-600S is designed to meet the demanding requirements of semiconductor manufacturing and research applications, where ultra-flat, highly-polished wafers are needed. Its automated process control unit and precision grinding, lapping and polishing processes enable the machine to produce superior results, with extremely tight flatness tolerances. The added capability of automating multiple process recipes makes OKAMOTO SPP-600S an ideal choice for both production and research facilities.