Used OKAMOTO SVG 202MK Ⅱ #9356467 for sale

OKAMOTO SVG 202MK Ⅱ is a wafer grinding, lapping, and polishing equipment uniquely designed and built for customers in the semiconductor industry. This system is ideal for high volume production of wafers, chips, and microprocessors due to its advanced features and ability to precisely and accurately generate some of the world's most accurate, uniform, and repeatable grinding, lapping, and polishing results. The unit is composed of a high-performance, precision mechanical structure, and a powerful, computer-controlled grinding machine. The structure of SVG 202MK Ⅱ consists of robust components that are able to achieve an extremely high degree of accuracy even after long use. This mechanical structure utilizes an input spindle, a rotary table, and a backlash-free rack and pinion drive tool to increase precision and repeatability. The asset is also equipped with highly durable linear guides, advanced ballscrews, an advanced digital servo motor model, and an auto-feeding mechanism to ensure high performance even under heavy workloads. The powerful computer-controlled grinding equipment allows for automated operation and features a user-friendly touchscreen display. This computer system utilizes multiple grinding algorithms which allow for a high degree of precision and repeatability in the finished product. Additionally, the unit is equipped with several different types of grinding wheels, such as diamond, CBN, and polycrystalline, to achieve a variety of manufacturing goals. OKAMOTO SVG 202MK Ⅱ is designed to provide a high degree of safety, reliability, and efficiency. It has several built-in safety devices, such as an emergency stop button, a safety cabin, and a dust proof vibration dampening chassis. Additionally, the machine is equipped with a range of self-monitoring devices, such as temperature sensors, water level sensors, and pressure sensors, to ensure safety and optimize tool performance. SVG 202MK Ⅱ offers excellent value for customers in the semiconductor industry by allowing them to mass produce wafers, chips, and microprocessors with the utmost precision and repeatability. This asset is capable of grinding, lapping, and polishing wafers with extreme accuracy and precision in a fraction of the time it would take to do the same job manually.