Used OKAMOTO SVG 502 MK II 8 #293586498 for sale
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OKAMOTO SVG 502 MK II 8 is a state-of-the-art fully automated wafer grinding, lapping and polishing equipment. This highly efficient and reliable system is designed to deliver extremely accurate surface finishes on a variety of wafers. With advanced accuracy, precision and repeatability, it is the perfect solution for ultra-high performance production applications. The unit features a fully enclosed grinding chamber that houses two independent wafer carriers. The carriers are linear X and Y stages powered by a precision high-speed brushless servo motor for vibration free operation. With a work area of 397mm x 397mm, this machine is capable of processing individual wafers up to 200mm in diameter with a maximum grind area of 130mm. An intuitive touchscreen monitor allows fast setting changes and ensures high production reliability. OKAMOTO SVG 502 also features a wide range of grinding, lapping, and polishing processes, making it suitable for a variety of wafers. The spindle assembly is equipped with a powerful 4kW spindle motor to provide maximum grinding efficiency and process consistency. For greater process control, the optional 'time pressure' control tool links the pressure exerted on the wafers to the grinding time. This asset allows for a stable wafer production rate appropriate to the specific application. An integrated automatic wafer loading model is included with OKAMOTO SVG 502. The loading equipment allows for quick set-up and reloading changes. The system also includes a vacuum loading plate which isolates the grinding/polishing process from airborne contamination, ensuring clean production. For extra safety and reliability, the unit includes a series of interlocks and alarms. These interlocks sense the presence of personnel in the working area and shut down the machine in case the safety protocols are not followed. OKAMOTO SVG 502 is built on a reliable and durable platform, ensuring consistent production and long-term reliability.
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