Used OKAMOTO SVG 502 MK II 8 #293616605 for sale

OKAMOTO SVG 502 MK II 8 is a wafer grinding, lapping, and polishing equipment designed to handle substrate sizes up to 200mm in diameter. The system features a high-precision flat grinding spindle capable of 12,000rpm and a lap spindle that operates at 6,000rpm. The unit has both single- and double-pass grinding capabilities, allowing for the simultaneous production of both flat and high aspect ratio surfaces. The machine includes a total of four grinding/polishing and lapping stations. Two of the stations are configured with programmable coarse-grind modules and are used for course grinding of the wafer surface. Two of the other stations feature precision polished platens and are used for wafer edge finishing and fine-grinding. All four stations have highly accurate mechanical, thermal and air cooling systems for improved accuracy and production consistency. The tool also includes a 9-axis robotic automation center, featuring 2-axis vertical movement, 4-axis turret movement, 1-axis pitch adjustment, and a 2-axis oscillation control. The robotic automation center allows for unsupervised manufacturing process, while an integrated electronic control unit (ECU) is used to monitor and control all machine functions, such as spindle speed, pitch, position, and grinding etc. The asset is powered by an easy-to-use PC-based user interface, capable of controlling all 4 grinding/polishing and lapping stations and is compatible with Windows, Linux and Mac operating systems. The user interface provides a range of programming settings for users to utilize, including robot-assisted part pick & placement, surface finishing, edge rounding, pad polishing, and more. OKAMOTO SVG 502 MKII 8 is a highly efficient and accurate wafer grinding, lapping, and polishing model that is perfect for your most demanding wafer substrate needs. It features high-precision grinding and lapping components, an intuitive user interface, and an advanced automation equipment meeting demanding process parameters. It is designed to deliver the highest quality wafer substrate materials possible.