Used OKAMOTO SVG 502 MK II 8 #9400798 for sale

OKAMOTO SVG 502 MK II 8
ID: 9400798
Vintage: 1997
Back grinder 1997 vintage.
OKAMOTO SVG 502 MK II 8 is an advanced wafer grinding, lapping, and polishing equipment designed to process any semiconductor wafer up to 8" in diameter. This system utilizes a two spindle top and bottom design for efficiently polishing wafers. The top spindle can be used to grind the front surface of the wafer, while the bottom spindle is used to grind the back side. The unit comes with two external grinding units, one for each side. This allows for efficient and precise grinding, lapping, and polishing of each wafer. The machine is equipped with precision balancing arms and a fully programmable CNC controller for easy setup and operation. It also features an electronically-controlled grit dispenser, designed to ensure a consistent wafer size and uniform quality. This tool also utilizes a vacuum asset, designed to suction off any residual abrasive materials during the grinding, lapping, and polishing processes. OKAMOTO SVG 502 MKII 8 is further equipped with a wet station, designed to keep the wafer cleaned as it moves through the grinding, lapping, and polishing stages. The model also utilizes a high-precision spindle, designed to provide a uniform grinding, lapping, and polishing of each wafer. This equipment also comes with a built-in leveling control device to ensure a consistent height between the two spindles during operation. To further improve the grinding, lapping, and polishing processes, SVG 502 MK II 8 is equipped with a temperature control system that optimizes the best performance for each wafer. This unit also comes with a built-in grinding stone cleaning machine, designed to remove any residual abrasive particles that may remain after grinding and lapping. Overall, SVG 502 MKII 8 is an advanced grinding, lapping, and polishing tool. It features easy setup and operation, precise balancing arms, an electronically controlled grit dispenser, and a vacuum asset which suction off any residual abrasives. The model also utilizes a temperature control equipment, leveling control device, and built-in grinding stone cleaning system, designed to provide superior results each time.
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