Used OKAMOTO SVG 502 MK II #293585703 for sale

OKAMOTO SVG 502 MK II Wafer Grinding, Lapping & Polishing Equipment is a technologically advanced system designed for precision surface grinding and polishing. The unit is composed of four machines: the main controller, the grinding spindle, the lapping head, and the polishing head. The main controller is responsible for the machine's data processing and visual display. It is fitted with a 10.1-inch touchscreen monitor, allowing for easy operation and the visualization of complex information. It also includes a high-precision rotary encoder for optimized spindle speed control and a micro-controller for accurate grinding and polishing. The grinding spindle is the core of the tool, providing the most precise and consistent grinding capability. It features an integral motor to drive the spindle, as well as an array of torque sensors and an adjustable press-fit spindle to optimize surface grinding. The spindle can rotate at speeds of up to 4,000 rpm and is fitted with a powerful fan for superior cooling. The lapping head provides the precision lapping necessary for more delicate surfaces. It is fitted with a dual-head lapping arm to optimize the process. The large table surface allows for the most efficient lapping operation, reducing the workload for the operator. Finally, the polishing head is the finishing touch for the asset. It is comprised of both rotary and flat polishing heads and is designed for precise and accurate polishing. To ensure excellent repeatability, it also features a four-point abrasion model that evenly distributes the force across the surface. All four machines of SVG 502 MK II are fully integrated, allowing for a smooth and effortless workflow. Combined, the four machines have provide a highly efficient solution for precision surface grinding and polishing.